1. 반도체 공정
- Metal interconnection
- Capping process
2. 에너지 재료 개발
- Electrocatalysts for fuel cells, water splitting, and CO2 conversion
- Si/non-Si inorganic semiconductors for solar cells
3. 재료의 전기화학적 특성 평가 및 분석
- Electrochemical reactions on electrochemical materials
- Electrode/electrolyte interface

2016 ~ 현재: 숭실대학교 화학공학과 조교수
2015 ~ 2016: University of Texas at Austin 박사후 연구원
2014 ~ 2015: Carnegie Mellon University 박사후 연구원
2013 ~ 2014: 서울대학교 신소재공동연구소 보조 연구원

[ 특 허 ]

1. “알릴 알콜을 포함하는 금속 씨앗층 평탄제 및 이를 이용한 씨앗층의 형성방법(Metal Seed Layer Leveler Comprising Allyl Alcohol and Method for Constructing Metal Seed Layer Using the Same)”, 권오중, 최인수, 임태호, 김광환, Korean patent, registered, 1014648600000

2. “반도체 장치 및 금속박막 형성방법(Semiconductor Device and Method for Forming Metal Thin Film)”, 권오중, 최인수, 임태호, 김광환, Korean patent, registered, 1011821550000 (2016)

3. “구리 CMP 후 캡핑 조성물(Capping Composition for Post Cu CMP)”, 김재정, 서명원, 윤영호, 황준하, 임영, 구효철, 임태호, Korean patent, registered, 1012001370000 (2012)

4. “구리 CMP 후 캡핑 조성물(Capping Composition for Post Cu CMP)”, 김재정, 서명원, 윤영호, 황준하, 임영, 구효철, 임태호, Korean patent, registered, 1011050880000 (2012)

1.“TElectrodeposition of Photoactive Silicon Films for Low-Cost Solar Cells J. Zhao, H. Yin, T. Lim, H. Xie, H.-Y. Hsu, F. Forouzan, and A. J. Bard J. Electrochem. Soc., 2016, 163, D506

2.“Preparation of Onion-like Pt-terminated Pt-Cu Bimetallic Nano-sized Electrocatalysts for Oxygen Reduction Reaction in Fuel Cells T. Lim, O.-H. Kim, Y.-E. Sung, H.-J. Kim, H.-N. Lee, Y.-H. Cho, and O. J. Kwon J. Power Sources, 2016, 316, 124

3.“Porous Indium Electrode with Large Surface Area for Effective Electroreduction of N2O K. H. Kim, T. Lim, M. J. Kim, S. Choe, S. Baek, and J. J. Kim Electrochem. Commun., 2016, 62, 13

4.“Investigation of Cu Growth Phenomena on Ru Substrate During Electroless Deposition Using Hydrazine as a Reducing Agent K. H. Kim, T. Lim, K. J. Park, H.-C. Koo, M. J. Kim, and J. J. Kim Electrochim. Acta, 2015, 151, 249

5.“Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2 Substrate for All-Wet Metallization Process K. H. Kim, T. Lim, M. J. Kim, S. Choe, K. J. Park, S. H. Ahn, O. J. Kwon, and J. J. Kim J. Electrochem. Soc., 2014, 161, D756

6.“Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization H. C. Kim, M. J. Kim, S. Choe, T. Lim, K. J. Park, K. H. Kim, S. H. Ahn, S.-K. Kim, and J. J. Kim J. Electrochem. Soc., 2014, 161, D749

7.“n-situ Transmittance Measurement for Characterization of Organic Additives in Cu Electroless Deposition K. J. Park, T. Lim, M. J. Kim, K. H. Kim, S.-M. Hwang, and J. J. Kim J. Electroanal. Chem., 2014, 731, 157

8.“Pd Seeding with the Sonochemical Method for Application of Cu Electroless Deposition to Cu Metallization T. Lim, K. H. Kim, K. Kim, H. Lee, H.-J. Kim, H.-N. Lee, J. J. Kim, and O. J. Kwon J. Electrochem. Soc., 2014, 161, D453

9.“The Effect of Inducing Uniform Cu growth on Formation of Electroless Cu Seed Layer T. Lim, M. J. Kim, K. J. Park, K. H. Kim, S. Choe, Y.-S. Lee, and J. J. Kim Thin Solid Films, 2014, 564, 299

10.“Effect of fluoroethylene carbonate on electrochemical battery performance and the surface chemistry of amorphous MoO2 lithium-ion secondary battery negative electrodes J. Park, I. Choi, M. J. Lee, M. H. Kim, T. Lim, K. H. Park, J. Jang, S. M. Oh, S. K. Cho, and J. J. Kim Electrochim. Acta, 2014, 132, 338

11.“Real-Time Observation of Cu Electroless Deposition: Synergetic Suppression Effect of 2,2’-Dipyridyl and 3-N,N-Dimethylaminodithiocarbamoyl-1-propanesulfonic Acid T. Lim, K. J. Park, M. J. Kim, H.-C. Koo, K. H. Kim, S. Choe, and J. J. Kim J. Electrochem. Soc., 2014, 161, D135

12.“Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition S. Choe, M. J. Kim, H. C. Kim, T. Lim, K. J. Park, K. H. Kim, S. H. Ahn, A. Lee, S.-K. Kim, and J. J. Kim J. Electroanal. Chem., 2014, 714-715 85

13.“Effects of nitrogen atoms of BTA and its derivatives on the properties of electrodeposited Cu films H. C. Kim, M. J. Kim, T. Lim, K. J. Park, K. H. Kim, S. Choe, S.-K. Kim, and J. J. Kim Thin Solid Films, 2014, 550, 421

14.“Direct Cu Electrodeposition on Ta Using Pd Nanocolloids: Effect of allyl alcohol on the formation of seed layer K. H. Kim, T. Lim, S. Choe, I. Choi, S. H. Ahn, M. J. Kim, K. J. Park, M. H. Lee, J. J. Kim, and O. J. Kwon J. Electrochem. Soc., 2013, 160, D3206

15.“Real-Time Observation of Cu Electroless Deposition: Effect of EDTA on Removing of Cu Oxide and Adsorption of Formaldehyde T. Lim, K. J. Park, M. J. Kim, H.-C. Koo, K. H. Kim, S. Choe, and J. J. Kim J. Electrochem. Soc., 2013, 160, D3134

16.“Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film M. J. Kim, K. J. Park, T. Lim, O. J. Kwon, and J. J. Kim J. Electrochem. Soc., 2013, 160, D3126

17.“Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection II. Enhancement of Cu Superfilling and Leveling M. J. Kim, T. Lim, K. J. Park, S.-K. Kim, and J. J. Kim J. Electrochem. Soc., 2013, 160, D3088

18.“Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection I. Effects of Anodic Steps on the Competitive Adsorption of the Additives Used for Superfilling M. J. Kim, T. Lim, K. J. Park, S.-K. Kim, and J. J. Kim J. Electrochem. Soc., 2013, 160, D3081

19.“Real-Time Observation of Cu Electroless Deposition: Adsorption behavior of PEG during Cu Electroless Deposition T. Lim, K. J. Park, M. J. Kim, H.-C. Koo, K. H. Kim, S. Choe, Y.-S. Lee, and J. J. Kim J. Electrochem. Soc., 2013, 160, D3015

20.“Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling S. Choe, M. J. Kim, H. C. Kim, T. Lim, and J. J. Kim J. Electrochem. Soc., 2013, 160, D202

21.“One-Pot Synthesis of PdAu-Au Core-Shell Bimetallic Nanoparticles Using Electrodeposition and Their Optical Property M. J. Kim, K. J. Park, T. Lim, S. Choe, T. Yu, and J. J. Kim J. Electrochem. Soc., 2013, 160, E1

22.“Superfilling of Cu-Ag Using Electrodeposition in Cyanide-Based Electrolyte M. J. Kim, S. H. Yong, H. S. Ko, T. Lim, K. J. Park, O. J. Kwon, and J. J. Kim J. Electrochem. Soc., 2012, 159, D656

23.“Electrodeposited Ni Dendrites with High Activity and Durability for Hydrogen Evolution Reaction in Alkaline Water Electrolysis S. H. Ahn, S. H. Hwang, S. J. Yoo, I. Choi, H.-J. Kim, J. H. Jang, S. W. Nam, T.-H. Lim, T. Lim, S.-K. Kim, J. J. Kim J. Mater. Chem., 2012, 22, 15153

24.“Electrochemical Preparation of Pt-based Catalysts on Carbon Paper Treated with Sn sensitization and Pd activation S. H. Ahn, I. Choi, O. J. Kwon, T. Lim, and J. J. Kim Int. J. Hydrogen Energ., 2012, 37, 41

25.“Conformal Cu Seed Layer Formation by Electroless Deposition in Non-Bosch through Silicon Vias K. J. Park, M. J. Kim, T. Lim, H.-C. Koo, and J. J. Kim Electrochem. Solid-State Lett., 2012, 15, D26

26.“Characteristics of Pulse-Reverse Electrodeposited Cu Thin Film II. Effects of Organic Additives M. J. Kim, T. Lim, K. J. Park, O. J. Kwon, S.-K. Kim, and J. J. Kim J. Electrochem. Soc., 2012, 159, D544

27.“Characteristics of Pulse-Reverse Electrodeposited Cu Thin Films I. Effects of the Anodic Step in the Absence of an Organic Additive M. J. Kim, T. Lim, K. J. Park, S. K. Cho, S.-K. Kim, and J. J. Kim J. Electrochem. Soc., 2012, 159, D538

28.“Real-Time Observation of Cu Electroless Deposition Using OCP Measurement Assisted by QCM T. Lim, K. J. Park, M. J. Kim, H.-C. Koo, and J. J. Kim J. Electrochem. Soc., 2012, 159, D724

29.“Optimization of Catalyzing Process on Ta Substrate for Copper Electroless Deposition Using Electrochemical Method T. Lim, H.-C. Koo, K. J. Park, M. J. Kim, S.-K. Kim, and J. J. Kim J. Electrochem. Soc., 2012, 159, D142

30.“Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-Situ Transmittance Measurement K. J. Park, H.-C. Koo, T. Lim, M. J. Kim, O. J. Kwon, and J. J. Kim J. Electrochem. Soc., 2011, 158, D541

31.“Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate S. Ki. Cho, M. J. Kim, T. Lim, O. J. Kwon, and J. J. Kim J. Vac. Sci. Tech. B, 2011, 29, 011004-1

32.“Room-Temperature Electroless Deposition of CoB Film and its Application as In Situ Capping During Buffing Process T. Lim, H.-C. Koo, K. H. Kim, K. J. Park, M. J. Kim, O. J. Kwon, and J. J. Kim Electrochem. Solid-State Lett., 2011, 14, D95

33.“Pulse Electrodeposition for Improving Electrical Properties of Cu Thin Film M. J. Kim, S. K. Cho, H.-C. Koo, T. Lim, K. J. Park, and J. J. Kim J. Electrochem. Soc., 2010, 157, D564

34.“A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization J. Electrochem. Soc., 2010, 157, D187